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STATSChP
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Octavia
Supreme |
09-Apr-2014 09:48
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Holding pretty well abit correction past few days.Hope for takeover news will be better lor.
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central
Senior |
09-Apr-2014 09:31
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LAI LIAO..............40..........50........60......> > > > > > > $1 HOPE ONLY ! |
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Octavia
Supreme |
04-Apr-2014 15:59
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Notice of Twentieth Annual General Meeting
NOTICE IS HEREBY GIVEN THAT the Twentieth Annual General Meeting (the &ldquo Annual General Meeting&rdquo ) of STATS ChipPAC Ltd. (&ldquo STATS ChipPAC&rdquo or the &ldquo Company&rdquo ) will be held at The Grassroots&rsquo Club, 190 Ang Mo Kio Avenue 8, Singapore 568046, on 22 April 2014 at 10.00 a.m. (Singapore time) to transact the following routine and special business: Routine Business (1) To re-appoint the following Directors, each of whom will retire under Section 153(6) of the Companies Act, Chapter 50 of Singapore (the &ldquo Companies Act&rdquo ), to hold office from the date of this Annual General Meeting until the next annual general meeting of STATS ChipPAC: (a) Mr. James A. Norling (b) Mr. R. Douglas Norby and (c) Mr. Pasquale A. Pistorio. (2) To re-elect the following Directors, each of whom will retire pursuant to Article 94 of the Articles of Association of STATS ChipPAC and who, being eligible, offer themselves for re-election: (a) Mr. Peter Seah Lim Huat and (b) Mr. Tan Lay Koon. (3) To adopt the Audited Financial Statements of STATS ChipPAC for the financial year ended 29 December 2013, together with the Reports of the Directors and the Auditors. (4) To re-appoint PricewaterhouseCoopers LLP as Auditors to hold office until the conclusion of the next annual general meeting of STATS ChipPAC at a remuneration to be determined by the Audit Committee of the Board of Directors. (5) To approve Directors&rsquo fees totalling approximately US$750,000 (approximately S$952,500 based on the exchange rate as of 7 March 2014) for the financial year ending 28 December 2014. Special Business Ordinary Resolutions (6) To consider and, if thought fit, to pass, with or without modifications, the following resolutions which will be proposed as ordinary resolutions: (a) Authority to allot and issue shares and to create and issue instruments and to allot and issue shares in connection therewith pursuant to Section 161 of the Companies Act. That pursuant to Section 161 of the Companies Act, the Directors be and are hereby authorised to: (I) (i) allot and issue shares in the capital of STATS ChipPAC whether by way of rights, bonus or otherwise and/or (ii) make or grant offers, agreements or options (collectively, &ldquo Instruments&rdquo ) that might or would require shares in the capital of STATS ChipPAC to be allotted and issued, including but not limited to the creation and issue of (as well as adjustments to) warrants, debentures or other instruments convertible into shares, at any time and upon such terms and conditions and for such purposes and to such persons as the Directors may in their absolute discretion deem fit and (II) (notwithstanding the authority conferred by this resolution may have ceased to be in force) issue shares pursuant to any Instrument made or granted by the Directors while this Resolution is in force, provided that: (1) the aggregate number of shares to be issued pursuant to this Resolution (including shares to be issued pursuant to Instruments made or granted under this Resolution) does not exceed 50% of the total number of issued shares (excluding treasury shares) in the capital of STATS ChipPAC (as calculated in accordance with sub-paragraph (2) below), of which the aggregate number of shares to be issued other than on a pro rata basis to shareholders of STATS ChipPAC (including shares to be issued pursuant to Instruments made or granted under this Resolution) does not exceed 10% of the total number of issued shares (excluding treasury shares) in the capital of STATS ChipPAC (as calculated in accordance with sub-paragraph (2) below) (2) (subject to such manner of calculation as may be prescribed by the Singapore Exchange Securities Trading Limited (&ldquo SGX-ST&rdquo )) for the purpose of determining the aggregate number of shares that may be issued under sub-paragraph (1) above, the total number of issued shares (excluding treasury shares) shall be based on the total number of issued shares (excluding treasury shares) in the capital of STATS ChipPAC, at the time this Resolution is passed, after adjusting for: a. new shares arising from the conversion or exercise of any convertible securities or share options or vesting of share awards which are outstanding or subsisting at the time this Resolution is passed and b. any subsequent bonus issue, consolidation or subdivision of shares (3) in exercising the authority conferred by this Resolution, STATS ChipPAC shall comply with the provisions of the Listing Manual of the SGX-ST for the time being in force (unless such compliance has been waived by the SGX-ST) and the Articles of Association for the time being of STATS ChipPAC and (4) (unless revoked or varied by STATS ChipPAC in a general meeting) the authority conferred by this Resolution shall continue in force until the conclusion of the next annual general meeting of STATS ChipPAC or the date by which the next annual general meeting of STATS ChipPAC is required by law to be held, whichever is the earlier. (b) Authority to allot and issue shares pursuant to the STATS ChipPAC Ltd. Substitute Share Purchase and Option Plan and the STATS ChipPAC Ltd. Substitute Equity Incentive Plan (collectively, the &ldquo Substitute Plans&rdquo ). That the Directors be and are hereby authorised to allot and issue from time to time such number of shares of STATS ChipPAC as may be required to be issued pursuant to the exercise of the options under the Substitute Plans. (c) Authority to allot and issue shares pursuant to the STATS ChipPAC Ltd. Share Option Plan (the &ldquo Share Option Plan&rdquo ). That the Directors be and are hereby authorised to allot and issue from time to time such number of shares of STATS ChipPAC as may be required to be issued pursuant to the exercise of the options under the Share Option Plan. (d) Authority to grant awards and allot and issue shares pursuant to the STATS ChipPAC Ltd. Performance Share Plan 2013 (the &ldquo PSP 2013&rdquo ). That the Directors be and are hereby authorised to grant awards in accordance with the provisions of the PSP 2013 and to allot and issue from time to time such number of fully paid ordinary shares in the capital of STATS ChipPAC as may be required to be allotted and issued pursuant to the vesting of awards granted under the PSP 2013, provided that the aggregate number of ordinary shares in the capital of STATS ChipPAC allotted and issued under the PSP 2013 shall not exceed the limits specified in the rules of the PSP 2013. BY ORDER OF THE BOARD Janet T. Taylor Company Secretary Date: 3 April 2014 Notes: (1) A shareholder is a person whose name appears on the Depository Register of The Central Depository (Pte) Limited in Singapore or a person registered in STATS ChipPAC&rsquo s Register of Shareholders (i.e. Members). (2) A shareholder entitled to attend and vote at the Annual General Meeting is entitled to appoint a proxy to attend and vote on his behalf. A proxy need not be a shareholder of STATS ChipPAC. Shareholders may appoint any member of the Board or any other person as their proxy. The instrument appointing a proxy must be deposited at the registered office of STATS ChipPAC at 10 Ang Mo Kio Street 65, Techpoint #05-17/20, Singapore 569059 not less than 48 hours before the time appointed for holding the Annual General Meeting or at any adjournment thereof. A proxy may be revoked at any time, not less than 48 hours before the time set for the Annual General Meeting by the shareholder submitting a subsequently dated instrument appointing a proxy or at the Annual General Meeting prior to the vote of the resolution by such shareholder attending the Annual General Meeting and voting in person. (3) STATS ChipPAC is subject to the continuing listing rules of the SGX-ST. (4) STATS ChipPAC employs financial year reporting periods that end on the Sunday nearest and prior to 31 December. STATS ChipPAC&rsquo s financial year 2013 ended on 29 December 2013. |
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central
Senior |
03-Apr-2014 22:37
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Apple has switched its chip manufacturing orders away from Samsung and TSMC, relying on Amkor Technology and STATS ChipPAC to make the processors for its next-generation iDevices, according to a new report. It may be hard to grasp that Apple no longer relies on Samsung to make its A-series chips, but this move has been predicted by analysts long ago.    
In what can be considered a turn of events, neither Samsung nor Taiwan Semiconductor Manufacturing Company (TSMC) has managed to land orders for the A8 chip destined to be used in 2014 iDevices, including the iPhone 6. That&rsquo s if  DigiTimes' reporting is to be considered accurate, of course. According to unnamed industry sources, &ldquo Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken over by Advanced Semiconductor Engineering (ASE).&rdquo As readers will notice, there are currently three chip makers rushing to fulfill Apple&rsquo s orders, and neither of them is the current A7-chip supplier. And while Samsung appears to have been phased out completely, TSMC remains aboard as a backup supplier, according to the sources. &ldquo Taiwan Semiconductor Manufacturing Company (TSMC), which is believed to have landed foundry orders for Apple' s next-generation A8 chip, has also secured wafer bumping orders for the processor as part of its turnkey solution,&rdquo the same people told the Taiwanese publication. However, TSMC will only start bulk production of the A8 chip using 20nm technology in the second quarter of this year, the report adds. Finally, the sources reportedly said that &ldquo Apple' s A8 chip will be a package-on-package (PoP) SoC solution comprising processors and mobile DRAM in a single package.&rdquo So far, Apple has sandwiched only the graphics inside the PoP, but now it seems it wants the RAM in there too. |
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CraigFoo
Elite |
03-Apr-2014 14:01
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Statschp. Been tracking this. Retested 0.365 and successfully breaching it. Currently holding well at 0.37. Looks like its ready to trend higher. Looking at 0.4 by friday. Bear in mind. Breaching of 0.365 is a big move.   |
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Octavia
Supreme |
03-Apr-2014 09:18
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Singapore' s electronics PMI up at 51.6 in March |
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Secret_Squirrel
Elite |
13-Mar-2014 21:02
Yells: "Stay curious but skeptical" |
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STATS ChipPAC Ltd. (" STATS ChipPAC" or the " Company" ), a leading provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing. This breakthrough approach, known as FlexLine?, delivers an unmatched level of flexibility and cost savings for wafer level packaging (WLP). With conventional WLP, an integrated circuit (IC) is fabricated, packaged and tested while still in a wafer format to streamline the manufacturing process. WLP leverages the same semiconductor equipment infrastructure as wafer fabrication which is progressively more expensive for larger wafer diameters and finer silicon (Si) geometries. The costs associated with transitioning to larger wafer diameters have resulted in extreme pricing pressures on WLP, particularly for mature technology such as wafer level chip scale packaging (WLCSP). " Growing demand for WLCSP in a range of advanced mobile products, from low-cost to high-end smartphones and tablets, is driving capacity constraints in the industry, particularly with 200mm wafers. This is causing extreme pressure on our customers to weigh the high cost of transitioning to more advanced silicon nodes against the need to achieve dramatic cost reductions for more competitive end products," said Chong Khin Mien, Senior Vice President of Product and Technology Marketing, STATS ChipPAC. " Capacity and cost challenges for WLCSP exist today in 200mm and 300mm wafer diameters and will inevitably intensify when the semiconductor industry transitions to 450mm wafers. This is an exciting time to drive a fundamental change in the manufacturing process for WLCSP." STATS ChipPAC's new FlexLine method is an innovative approach to wafer level manufacturing that provides freedom from wafer diameter constraints while enabling supply chain simplification and significant cost reductions that are not possible with a conventional manufacturing flow. FlexLine seamlessly processes multiple silicon wafer diameters in the same manufacturing line without changing equipment sets or bill of materials used in the packaging process. In fact, FlexLine enables customers to simplify their supply chain across multiple devices, thereby achieving significant cost reductions that are not possible with a conventional manufacturing flow. " STATS ChipPAC is driving a significant paradigm shift in wafer level packaging with our FlexLine method. We have leveraged our proven reconstitution process, which has produced more than half a billion units of fan-out wafer level packages, to extend flexibility and cost advantages to fan-in WLCSP devices. We are the first company in the world to introduce a WLP method that is completely independent of incoming wafer sizes, including future 450mm wafer size, and delivers unprecedented flexibility in producing both fan-out and fan-in packages on the same manufacturing line," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. By normalising multiple wafer diameters to a uniform processing size through reconstitution, the original wafer diameters become irrelevant as this no longer dictates manufacturing capacity or limits process capabilities. When 200mm wafers are reconstituted into 300mm or larger panel sizes, customers have greater potential for cost reduction than conventional WLP manufacturing. As the panel size increases, the cost of producing wafer level packages drops significantly when compared to conventional WLP methods. Dr. Han noted, " With FlexLine?, we are able to help our customers achieve at least a 15-30% cost reduction using the optimum design requirements for their WLCSP devices. Later this year we will introduce unique technology enhancements to WLCSP that improve the reliability performance over WLCSPs produced with conventional methods. Our FlexLine? method provides a strong manufacturing platform that enables future innovation in our wafer level packaging portfolio." Source:  http://www.statschippac.com |
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teddytan438
Senior |
13-Mar-2014 12:48
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temasek rally? | ||
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Spivvy
Elite |
05-Mar-2014 09:16
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Zhun boh?! Global recovery still at snail's pace leh.. Got dividends to collect boh?
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Bon3260
Supreme |
05-Mar-2014 08:48
Yells: "Ooo Ooo Aaa Aaa!" |
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Cheong ah!!! ('',) Note: StatsChP close 0.325 as @ 04-Mar-2014 |
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Secret_Squirrel
Elite |
31-Jan-2014 14:18
Yells: "Stay curious but skeptical" |
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can accumulate once it hit 30 cents | ||
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Octavia
Supreme |
30-Jan-2014 11:04
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STATS ChipPAC: Post 4Q13 Net Loss Of US$6.1 Million Vs 4Q12 Net Profit Of US$1.7 Million. Revenue for the fourth quarter and full year 2013 decreased by 17.8% and 6.1% from the fourth quarter and full year 2012 respectively. Excluding the benefit of an extra week last year, revenue decrease in the fourth quarter and full year 2013 was 11.4% and 4.2% respectively. Net loss for the fourth quarter of 2013 was $6.1 million compared to net income of $13.3 million in the prior quarter and net income of $1.7 million in the fourth quarter of 2012... |
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CraigFoo
Elite |
29-Jan-2014 19:01
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Another set of disappointing results. Guess the only bright spot is Temasek is holding 83%. Closed flat at 0.32   |
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Markie
Senior |
22-Jan-2014 15:35
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At 33.5 cents per share, STATS is valued at 0.63x P/B. While the company has been struggling to make reasonable profit, it should definitely be valued more than at current price. Furthermore, at this PB level, the stock was only last seen during the global financial crisis. Scoop up some shares to await surprises for a Temasek Holdings stock that was once taken private. |
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Octavia
Supreme |
22-Jan-2014 14:19
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STATS ChipPAC Recognised for Patent Innovations for the Third Consecutive Year by IEEE
Singapore ? 22 January 2014 ? STATS ChipPAC Ltd. (?STATS ChipPAC? or the ?Company? ? SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the third consecutive year among the world?s top 20 semiconductor manufacturing companies in the 2013 Patent Power Scorecard published by IEEE Spectrum, the flagship magazine of the Institute of Electrical and Electronics Engineers (IEEE), the world?s largest professional association for the advancement of technology, and 1790 Analytics, an Intellectual Property (IP) evaluation firm. STATS ChipPAC is the only Outsourced Semiconductor Assembly and Test (OSAT) service provider ranked among the top 20 companies in the Semiconductor Manufacturing category. The Patent Power Scorecards are based on quantitative benchmarking of the patent portfolios of more than 5,000 leading commercial enterprises, academic institutions, nonprofit organisations and government agencies worldwide. The benchmarking process takes into account not only the size of an organisation?s patent portfolio, but also the quality of that portfolio in terms of growth, impact, originality and general applicability. ?Today?s consumers want more powerful yet increasingly smaller electronic devices. Semiconductor packaging technology is a driving force in achieving smaller, faster, multi-functional devices. With consistent investments in research and development and focus on technology innovation, we are enabling our customers to overcome increasingly complex performance and form factor challenges in order to deliver industry leading products,? said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. STATS ChipPAC has been granted more than 1,000 patents by the U.S. Patent and Trademark Office (USPTO), more than any other company in the global OSAT industry. With over 60% of its IP in wafer level packaging, flip chip interconnect and 2.5D/3D integration, STATS ChipPAC offers its customers a competitive advantage with innovative packaging solutions that provide significant performance, size and cost advantages. Dr. Han summarised, ?We have developed a continuous path of innovative and cost effective advanced packaging solutions that provide numerous advantages to customers in the mobile communications market as well as new and evolving markets such as cloud computing and wearable devices. Our strong patent portfolio and culture of innovation are key factors why STATS ChipPAC is the go-to OSAT provider that our customers can rely on for a comprehensive portfolio of advanced packaging and test solutions.? |
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Markie
Senior |
17-Jan-2014 18:10
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This 83 percent owned company by temasek is gonna blast with a recovery In 2014 :) | ||
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central
Senior |
17-Jan-2014 15:44
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Correct .Maybe lai liao !
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Octavia
Supreme |
15-Jan-2014 22:06
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Singapore ? 15 January 2014 ? STATS ChipPAC Ltd. (?STATS ChipPAC? or the ?Company? ? SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services, announced today that it will hold a conference call with analysts and investors on Thursday, 30 January 2014 at 8:00 a.m. in Singapore to discuss the Company?s results for the fourth quarter and full year 2013 and business outlook for the first quarter 2014.
The news release announcing the fourth quarter and full year 2013 results will be disseminated on 29 January 2014 after the Singapore Exchange Securities Trading Limited (?SGX-ST?) market closes. The dial-in number for the live audio call beginning at 8:00 a.m. (Singapore time) on Thursday, 30 January 2014 is +65-6823-2299 begin_of_the_skype_highlighting  +65-6823-2299  FREE    end_of_the_skype_highlighting. A live audio webcast of the conference call will be available on STATS ChipPAC?s website at www.statschippac.com.A replay of the call will be available 2 hours after the live through 14 February 2014 at www.statschippac.com and by telephone at 800-616-2127 begin_of_the_skype_highlighting  800-616-2127  FREE    end_of_the_skype_highlighting. The conference ID number to access the conference call and replay is 2312968. |
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Markie
Senior |
14-Jan-2014 10:37
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Vested at current levels in hope of a buyout :) | ||
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Markie
Senior |
26-Dec-2013 20:29
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Despite being 83.8%-owned by sovereign fund Temasek Holdings, the stock is currently trading at 0.6x P/BV and close to its lowest level since its IPO in 2000. With the retirement of high-interest debts and the closing down of loss-making plants, 2014 looks to be a brighter year for the company, underpinned by the robust demand for advanced wafer packaging services. (Edison Chen) |
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